Study on preparation and properties of phenol-formaldehyde-chinese fir liquefaction copolymer resin



Document title: Study on preparation and properties of phenol-formaldehyde-chinese fir liquefaction copolymer resin
Journal: Maderas : ciencia y tecnología
Database:
System number: 000544591
ISSN: 0718-221X
Authors: 1
2
3
3
1
1
Institutions: 1South China Agricultural University, College of Forestry, Guangzhou, Guangdong. P.R of China
2Liming Research Institute of Chemical Industry, Luoyang, Henan. P.R of China
3Guangdong Monitoring Station for Quality Supervision and Testing of Wood & Wood Products, Guangzhou, Guangdong. P.R of China
Year:
Season: May
Volumen: 16
Number: 2
Pages: 159-174
Country: Chile
Language: Inglés
English abstract A new zero-waste and zero-pollution composite adhesive labeled Chinese fir-based adhesive for exterior plywood was synthesized by blending alkaline Chinese fir (Cunninghamia lanceolata) liquid with a small amount of phenol-formaldehyde (PF). The free phenol and free formaldehyde content of the Chinese fir-based adhesive were sharply decreased compared to normal PF resin by more than 50%. The synthetic adhesive show with excellent water resistance and environmental friendliness, which had a 28h boil-dry-boil wet bonding strength of 1,73MPa according to standard JIS K6806-2003 and a formaldehyde emission of 0,045mg/L according to standard JIS A1460-2003. The structural properties and their thermal properties of cured adhesives were evaluated using Fourier transform infrared (FT-IR) and differential scanning calorimetry (DSC). The FT-IR analysis confirmed the expected chemical structure as the Chinese fir liquid reacted with formaldehyde and phenol which occurred at the wavenumbers of 1733, 1698, 1652cm-1 and 1077, 1048 cm-1. Although the DSC results indicated that the Chinese fir-based adhesive's curing need higher temperature than the control PF resin, the higher curing temperature hardly cripple the availability of Chinese fir-based resin in the plywood production.
Keyword: Chinese fir-based adhesive,
Formaldehyde,
Bonding properties,
FT-IR,
DSC
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