| Journal: | Ecletica quimica |
| Database: | |
| System number: | 000552459 |
| ISSN: | 0100-4670 |
| Authors: | Silva, Sheila Marques1 Silva, Carolina Paiva Nascimento2 Silva, Thiago de Carvalho3 Rezende, Mirabel Cerqueira4 Botelho, Edson Cocchieri1 Costa, Michelle Leali5 |
| Institutions: | 1São Paulo State University, Department of Materials and Technology, Guaratinguetá, Brazil., 2Federal University of São Paulo, Institute of Science and Technology, São José dos Campos, Brazil. Lightweight Structures Laboratory, LEL/IPT, São José dos Campos, Brazil., 3Federal University of São Paulo, Institute of Science and Technology, São José dos Campos, Brazil. Federal Center for Technological Education Celso Suckow da Fonseca, Angra dos Reis, Brazil., 4Federal University of São Paulo, Institute of Science and Technology, São José dos Campos, Brazil., 5São Paulo State University, Department of Materials and Technology, Guaratinguetá, Brazil. Lightweight Structures Laboratory, LEL/IPT, São José dos Campos, Brazil., |
| Year: | 2022 |
| Volumen: | 47 |
| Pages: | 83-99 |
| Country: | Brasil |
| Language: | Inglés |
| English abstract | Thermal and rheological characterizations were performed on prepreg produced with two different commercial epoxy resins - M21® and 8552® – aiming to study and optimize the curing cycle of structural components used in aerospace industry. Characterizations were performed by differential scanning calorimetry (DSC), rheology and dynamic mechanical analysis techniques were assessed and the results were correlated and supported by Fourier Transform Infrared spectroscopy. Additionally, to heating rates suggested by the material supplier, DSC analysis allowed to evaluate further heating rates: 2, 5, 10, 15 and 20 °C/min. Materials presented the n fractional order kinetic of cure and have in its formulation the presence of thermoplastics, in addition to epoxy and amine. Results confirmed that the best heating rates for processing both materials are the lower ones, as they result in a better control of the reactions between chemical compounds involved and the physical changes that are part of curing process stages. Results have analytically confirmed the suggested proposal for curing cycle from supplier is the best choice for materials involved. |
| Keyword: | cure kinetic, DSC, DMA, rheology, FTIR |
| Full text: | Texto completo (Ver PDF) |
