Optimal Yield Rate in ACF Cutting Process of TFT-LCD Module Using Orthogonal Particle Swarm Optimization Based on Response Surface Design
Título del documento: Optimal Yield Rate in ACF Cutting Process of TFT-LCD Module Using Orthogonal Particle Swarm Optimization Based on Response Surface Design
Revista: Journal of applied research and technology
Base de datos: PERIÓDICA
Número de sistema: 000380499
ISSN: 1665-6423
Autores: 1
1
Instituciones: 1National Kaohsiung First University of Science and Technology, Department of Mechanical and Automation Engineering,, Nantze, Kaohsiung. Taiwán
Año:
Periodo: Dic
Volumen: 12
Número: 6
Paginación: 1165-1175
País: México
Idioma: Inglés
Tipo de documento: Artículo
Enfoque: Experimental, aplicado
Resumen en inglés Anisotropic Conductive Film (ACF) is essential material in LCM (Liquid Crystal Module) process. It is used in bonding process to make the driving circuit conductive. Because the price of TFT-LCD is getting lower than before in recent years, the ACF has relatively higher cost ratio. The conventional long bar ACF cutting unit is changed into short bar ACF cutting unit in new bonding technology. However, the new type machine was not optimized in process control and mechanical design. Therefore, the failure rate of new ACF cutting process is much higher than the one of the conventional process. This wastes the ACF material and rework cost is considerably large. How to make the manufacturing cost down effectively and promote the product quality is the main issue to maintain competition capability for the product. Therefore, the orthogonal particle swarm optimization (OPSO) is used to analyze the optimal design problem. The ACF cutting yield rate is selected to be objective function for optimization. The quality characteristic function for yield rate is used in orthogonal particle swarm optimization. Three control factors such as plasma clean speed, ACF peeling speed and ACF cutter spring setting are selected to study the effect of the yield rate. Results show that the proposed method can provide good optimal solution to improve the ACF cutting process for TFTLCD manufacturing process
Disciplinas: Ingeniería
Palabras clave: Ingeniería industrial,
Ingeniería mecánica,
Películas conductoras anisotrópicas,
Proceso de corte,
Método de superficie de respuesta,
Optimización por enjambre de partículas
Keyword: Engineering,
Industrial engineering,
Mechanical engineering,
Anisotropic conductive films,
Cutting process,
Response surface method,
Particle swarm optimization
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