| Revista: | Ingeniería mecánica, tecnología y desarrollo |
| Base de datos: | PERIÓDICA |
| Número de sistema: | 000455942 |
| ISSN: | 1665-7381 |
| Autores: | León Conejo, José Carmen1 Rubio Jiménez, Carlos Alberto1 Hernández Guerrero, Abel1 Rubio Arana, José Cuauhtémoc1 |
| Instituciones: | 1Universidad de Guanajuato, Facultad de Ingeniería Mecánica, Eléctrica y Electrónica, Salamanca, Guanajuato. México |
| Año: | 2007 |
| Volumen: | 2 |
| Número: | 5 |
| Paginación: | 168-176 |
| País: | México |
| Idioma: | Español |
| Tipo de documento: | Artículo |
| Enfoque: | Experimental, analítico |
| Resumen en inglés | This work presents a microchannel heat sink numerical analysis, with a trapezoidal cross section area, applying a constant heat flux typical of those present in high tech electronical devices. The analysis studies the effect of the aspect ratio between the large base and minor base of the channel, as well as the effect of the aspect between the large bse and the height of the channel.Water is the work fluid, supplying by a fluid actuator. Tha analyses considers the fluid properties and the base material thermal properties, variable with temperature. The capillary effects present in are not taken into account. The results provide the temperature profiles along the heat ink thermal resistance the local Nusselt number. This is the most parameter important to define the thermal behavior at the heat sink |
| Disciplinas: | Física |
| Palabras clave: | Termodinámica y física estadística, Canales trapeciales, Flujo de calor, Microcanales, Relación de aspecto |
| Keyword: | Aspect ratio, Heat flow, Microchannels, Trapezoidal channels |
| Solicitud del documento | |
