| Revista: | Journal of applied research and technology |
| Base de datos: | PERIÓDICA |
| Número de sistema: | 000427655 |
| ISSN: | 1665-6423 |
| Autores: | Mansoor, Muhammad1 Zilohu, Ahnaf Usman1 Mujahid, Muhammad2 Khan, Shaheed1 |
| Instituciones: | 1Institute of Industrial Control Systems, Rawalpindi. Pakistán 2National University of Sciences and Technology, School of Chemical and Materials Engineering, Rawalpindi. Pakistán |
| Año: | 2018 |
| Periodo: | Jun |
| Volumen: | 16 |
| Número: | 3 |
| País: | México |
| Idioma: | Inglés |
| Tipo de documento: | Artículo |
| Enfoque: | Aplicado, descriptivo |
| Resumen en inglés | Soldering electrical contacts to gold thin films is a matter of consideration due to high soldering temperature, restricted wetting, excessive scavenging and low strength offered by most of the common soldering alloys. Indium alloys offer certain benefits for gold soldering justifying their increased cost. In the present study, hypo-, hyper- and eutectic In-Ag solder were prepared and investigated for compositional and structural homogeneity, soldering temperature, contact angle, spreading factor, scavenging zone and scavenging phase (i.e. Auln2). It was found that addition of silver (-3.5%) ameliorated the above mentioned characteristics for better control of soldering practice with gold thin films besides lowering the soldering temperature |
| Disciplinas: | Ingeniería |
| Palabras clave: | Ingeniería de materiales, Soldadura, Indio-Plata, Temperatura de soldado, Angulo de contacto |
| Keyword: | Materials engineering, Welding, Indium-Silver, Welding temperature, Contact angle |
| Texto completo: | Texto completo (Ver HTML) Texto completo (Ver PDF) |
